Bob Willis
ASKbobwillis.com
The introduction of 01005's does have its drawbacks.  The pad sizes required are more difficult to print, and parts require to be placed with a higher degree of accuracy. The substrate stretches in different direction during reflow and any heating process. The lead-free reflow process may also cause defects through the movement of parts, whilst the package size makes inspection and repair more complicated. In reality the use of 01005 parts are limited but any design and process engineer must be failure with the issues and make sure his process is capable.

System-in-Package (SiP) technologies provide a system or sub-system level of functionality within a single package outline and combine one or more integrated circuit die with passive and other supporting components. The ability to integrate devices and to mix technologies within a standard package outline can lead to smaller footprints than standard SMT implementations, to improved performance, lower NREs and reduced New Product Introduction (NPI) cycle times when compared with the System-on-Chip (SoC) option and to useful costs savings at the system or sub-system level. Passive Integration provides a further series of very complementary size, weight, performance and costs benefits. This paper will review the role of passive integration in the development and adoption of SiP technologies.

Walter Huck,
Murata Europe,
High density mounting technology has rapidly advanced due to the trend for smaller mobile equipment and modules. The next generation mounting technology to build passive components inside substrates is being established.
Compared with surface mounting components, there are several more conditions imposed to substrate built-in components. Murata has succeeded in commercializing 1005 size (1.0 x 0.5mm) low profile 150µm built-in capacitor for substrates realizing 0.1µF capacitance utilizing leading edge dielectric material technology and
external electrode formation technology

 

 

 

Grace O’Malley
iNEMI
Passive components, resistors-capacitors, inductors and circuit protection - are the highest volume components in electronics devices with annual sales in the region of $30 billion. The development and use of passive components are driven by cost, regulatory and technical requirements in end user segments. Communication, transportation, education, agriculture, entertainment, healthcare, environmental controls, defense and research all rely heavily upon electronics today. This diversity of applications and the never ending demand for both lower cost and higher performance present a number of challenges to the passives industry going forward. This presentation will cover highlights from the “Passive Components” Chapter of the 2009 iNEMI Roadmap that may give insight into the challenges
and opportunities for growth in this key element of the electronics industry over the next ten years.
Tomohide Wada, ‘Capacitors Get Powerful: New Energy Device Technologies/EDLC and new type Capacitors’
The needs for new energy storage devices are getting very common from the perspective of environment issue nowadays. Electrolytic capacitor makers provide solutions such as EDLC or new capacitor types for use in energy supplies in the new application-needs of HEV, solar cell and so on. This presentation will explain about the current and future condition of these market categories. And also there is potential for standardization, creating communication interfaces that connect between the new energy devices and the application designers.

Tomohide Wada
Panasonic Electronics Devices Ltd
The needs for new energy storage devices are getting very common from the perspective of environment issue nowadays. Electrolytic capacitor makers provide solutions such as EDLC or new capacitor types for use in energy supplies in the new application-needs of HEV, solar cell and so on. This presentation will explain about the current and future condition of these market categories. And also there is potential for standardization, creating communication interfaces that connect between the new energy devices and the application designers.

 

 

 

Peter Harrop
IDTechEx
Printing passive components can reduce their cost by 99% and variously make them edible, tightly rollable, fully transparent, fault tolerant, wide area and better performing. The missing fundamental passive component the memristor has recently been made and it required thin film technology. Printed electronics can be environmental, biodegradable and disposable and it will be used where conventional electronics is too poisonous, expensive, bulky and heavy. Examples are consumer packaged goods and medical disposables. Contrary to the arguments of certain special interest groups, the end point for printed electronics will not be making everything using organic inks (“plastic electronics”) but the use of inorganic, organic and composite materials as appropriate - often all in one device. Increasingly, circuits will be printed on top of each other and the market for printed electronics will rocket to around $57 billion in 2019 and $300 billion ten years later. Many printing technologies will be employed. Welcome to the era of electronic devices in tens of billions up to trillions yearly.